More than 100 million chips from Fab 21 in 2026, packaged next door in Peoria.
Apple booked more than 100 million chips from TSMC Arizona’s Fab 21 for 2026, packaged next door in Peoria. That is volume on a US leading-edge wafer, not a ceremonial lot.
Fab 1 is in volume on 4-nanometer. Fab 2 takes 3-nanometer. AMD and the humanoid stacks that need a real NPU buy this wafer too. More fabs are staked in the desert.
A robot that thinks on a Taiwanese NPU has a different supply story than one that thinks on Phoenix silicon. Apple’s 2026 book is how Fab 21 stops being a construction site.